SECO/WARWICK will be presenting three (3) cutting-edge technology presentations at this year’s ASM Heat Treat Show event. The presentations are listed below but we encourage everyone to stop by booth 1813 and discuss these state-of-the-art technologies with our booth personnel. See you in Columbus.
SECO/WARWICK Papers Being Presented at ASM Heat Treat Show
PAPER #1
Paper Title: Improving the Nitriding Process Using Zero-Flow® Gas Nitriding Technology
Session Title: Advances in Heat Treating II
Date: Tuesday, October 24, 2017
Session Start Time: 2:00 PM
Presentation Time: 3:00 PM – 3:20 PM
Room: A210-A212
Speaker: Bill Warwick, Tomasz Przygonski, Prof. Leszek Maldzinski
Link: https://asm.confex.com/asm/ht2017/webprogram/Paper43685.html
Moderator: Rick Sisson, WPI
PAPER #2
Paper Title: True Single-Piece Flow Case Hardening for In-Line Manufacturing
Session Title: Vacuum Processes and Technology I
Date: Tuesday, October 24, 2017
Session Start Time: 4:00 PM
Presentation Time: 4:00 PM – 4:20 PM
Room: A213-215
Speaker: Tom Hart, Maciej Korecki, PhD.
Link: https://asm.confex.com/asm/ht2017/webprogram/Paper43745.html
Moderator: Roger Jones, Solar Atmospheres
PAPER #3
Paper Title: Optimizing Cycle Time and Process Flexibility Using Vacuum Sealed Quenching
Session Title: Vacuum Processes and Technology III
Date: Wednesday, October 25, 2017
Session Start Time: 4:00 PM
Presentation Time: 4:40 PM – 5:00 PM
Room: A220-A222
Speaker: Don Marteeny, Maciej Korecki, PhD.
Link: https://asm.confex.com/asm/ht2017/webprogram/Paper43746.html
Moderator: Dennis Beauchesne, ECM-USA Inc.
Schedule an appointment:
events@secowarwick.com
Oct 24-26, 2017
Address:
The Greather Columbus Convention Center
Website:
http://www.asminternational.org/web/heat-treat-201
